Polycrystalline diamond micro-powder
Product features: strong cutting force, high polishing precision, and excellent grip.
Recommended applications: Precision grinding and polishing of wafers such as SiC and Al₂O₃; grinding and polishing of ceramic materials; precision grinding and polishing of metallic materials such as stainless steel and aluminum alloys.
Recommended applications: Precision grinding and polishing of wafers such as SiC and Al₂O₃; grinding and polishing of ceramic materials; precision grinding and polishing of metallic materials such as stainless steel and aluminum alloys.
Electroplated diamond micro-powder
Product Features: Coated diamonds are produced by applying a metal coating of a specified thickness—such as nickel, copper, or titanium—to the diamond surface using chemical plating, electroplating, or other methods. This enhances the bond between the diamond and the matrix, improves abrasive retention, mitigates thermal shock, and protects the diamond from oxidation and graphitization, thereby significantly extending the service life of the finished product.
Recommended applications: Commonly used in resin-bonded and metal-bonded products, among other fields.
Recommended applications: Commonly used in resin-bonded and metal-bonded products, among other fields.