Polycrystalline diamond micro-powder
Recommended applications: Precision grinding and polishing of wafers such as SiC and Al₂O₃; grinding and polishing of ceramic materials; precision grinding and polishing of metallic materials such as stainless steel and aluminum alloys.
Category:
Plated and quasi-polycrystalline products
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Product Description
Product features: strong cutting force, high polishing precision, and excellent gripping power.
Recommended applications: Precision grinding and polishing of wafers such as SiC and Al₂O₃; grinding and polishing of ceramic materials; Precision grinding and polishing of metallic materials such as stainless steel and aluminum alloys.
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Polycrystalline diamond micro-powder
Product features: strong cutting force, high polishing precision, and excellent grip.
Recommended applications: Precision grinding and polishing of wafers such as SiC and Al₂O₃; grinding and polishing of ceramic materials; precision grinding and polishing of metallic materials such as stainless steel and aluminum alloys.
Electroplated diamond micro-powder
Product Features: Coated diamonds are produced by applying a metal coating of a specified thickness—such as nickel, copper, or titanium—to the diamond surface using chemical plating, electroplating, or other methods. This enhances the bond between the diamond and the matrix, improves abrasive retention, mitigates thermal shock, and protects the diamond from oxidation and graphitization, thereby significantly extending the service life of the finished product.
Recommended applications: Commonly used in resin-bonded and metal-bonded products, among other fields.
High-Purity Diamond Micropowder JX-HP
Product Features: High-purity diamond micro‑powder is produced through secondary processing of finished micro‑powder. Following treatment, the particle surfaces exhibit exceptionally high cleanliness, with individual elemental impurities kept below 15 ppm and total impurities maintained within 50 ppm.
Recommended applications: High-purity fine powders are suitable for the JGM, JBM, and JBM‑H series. Depending on the specific grade, they are recommended for electroplating and ceramic‑bonded tools, with primary use in the electronics industry—including high‑end grinding, precision lapping, polishing, and dicing.
Ultrafine, highly dispersible micronized powder JX-CP
Product Features: Our custom‑made products are tailored to meet a wide range of customer requirements, including powder morphology, particle size distribution, oversized particle control, and surface cleanliness.
Suggested Use: Customized products are compatible with all product lines offered by our company.
Micro-powder JBM-HB, specially designed for electroplated grinding heads
Product Features: Made from high‑strength diamond, processed through a specialized crushing and shaping procedure. Exhibits high particle‑size uniformity and a blocky morphology.
Recommended applications: Suitable for the production of polycrystalline diamond, composite sheets, and high-end diamond tools for grinding and polishing.
Micro-powder JBM-H, specially formulated for fret saws
Product Features: Made from high‑strength diamond, processed through a specialized crushing technique and lightly shaped. It exhibits a high degree of particle size uniformity, with a semi‑blocky morphology and sharply defined edges.
Recommended applications: Suitable for manufacturing high-end diamond tools that require a balance of strength, wear resistance, and sharpness.
Contact Us
Zhecheng JINXIN Abrasives Co., Ltd.
Tel：+86-371-55619682
E-mail：hnhj@hnhjdiamond.com
Marketing Center：Block IFC-C, Kailin, Jinshui East Road, Zhengzhou City
Production center：No. 276, Gongye Road, Industrial Concentration Zone, Zhecheng County, Henan Province
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