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CVD Diamond: A Superheat-Dissipating New Material Born to Reduce Fever

As end products increasingly demand thinner form factors and higher efficiency, the evolution of semiconductor solutions has moved beyond mere performance enhancement; thermal management and heat dissipation have also become critical considerations in semiconductor design. Heat generation is primarily influenced by chip manufacturing processes and temperature-control algorithms, while heat‑dissipation performance can be optimized through material selection and product‑level structural design.

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How to Improve the Mechanical Strength of Diamond Grinding Wheels

To enhance the heat resistance and mechanical strength of phenolic resin binders in diamond grinding wheels, various fillers are incorporated during the preparation of resin-bonded abrasives to modify the phenolic resin. For example, adding copper powder improves the resin’s thermal stability; incorporating zinc oxide, chromium oxide, and similar compounds strengthens the resin’s mechanical properties; and introducing soft materials such as flaky graphite or molybdenum disulfide significantly enhances the grinding performance of resin-bonded tools.

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